Browse Prior Art Database

Molded Connector

IP.com Disclosure Number: IPCOM000091954D
Original Publication Date: 1968-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Kuzma, M: AUTHOR [+2]

Abstract

Resistance to rotation and push-through of the pins molded in connectors is enhanced by use of special shaped pins and selected molding materials. Pin 1 is has square shank portion 2 that is embedded in molding material 3. The latter has a selected shrinkage factor and the required insulation qualities. Printed circuit overlay 4 with plated through-holes 5 is bonded to the connector block to provide circuits to selected pins. Solder rings are positioned on the pins prior to backing the assembly to solder the connections.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Molded Connector

Resistance to rotation and push-through of the pins molded in connectors is enhanced by use of special shaped pins and selected molding materials. Pin 1 is has square shank portion 2 that is embedded in molding material 3. The latter has a selected shrinkage factor and the required insulation qualities. Printed circuit overlay 4 with plated through-holes 5 is bonded to the connector block to provide circuits to selected pins. Solder rings are positioned on the pins prior to backing the assembly to solder the connections.

1

Page 2 of 2

2

[This page contains 4 pictures or other non-text objects]