Browse Prior Art Database

Producing Solder Preforms

IP.com Disclosure Number: IPCOM000091969D
Original Publication Date: 1968-Jul-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Smith, MC: AUTHOR

Abstract

This method produces discrete solder preforms of various geometric designs. On thin metal substrate 2 a resist is selectively placed to expose the desired geometrical shapes. Substrate 2 is then chemically milled to produce the required geometries such as 6. Then substrate 2 is placed in a solder plating bath and the exposed geometric patterns of the chemically milled substrate are plated with solder. Substrate 2 is then removed from the solder plating bath and shaken or vibrated to free the desired solder preforms encased in patterns 6.

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Producing Solder Preforms

This method produces discrete solder preforms of various geometric designs. On thin metal substrate 2 a resist is selectively placed to expose the desired geometrical shapes. Substrate 2 is then chemically milled to produce the required geometries such as 6. Then substrate 2 is placed in a solder plating bath and the exposed geometric patterns of the chemically milled substrate are plated with solder. Substrate 2 is then removed from the solder plating bath and shaken or vibrated to free the desired solder preforms encased in patterns 6.

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