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Deposition in Recesses

IP.com Disclosure Number: IPCOM000091996D
Original Publication Date: 1968-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Lussow, RO: AUTHOR

Abstract

This method is for depositing metals in recesses in solid surfaces. A metal salt-organic polymer solution is deposited on the solid surface. The solid piece is spun rapidly to throw off excess solution and to dry the coating. With continued spinning, the surface of the solid piece is washed with a solvent to remove the coating from the outer surfaces, leaving the metal, salt-loaded film in the recesses. Heating reduces the salt and sinters the metal into place while burning away any carbonaceous residue. The drawing shows a typical solid piece consisting of an epitaxial silicon layer with thermally grown silicon dioxide on it. A platinum film is deposited in the recesses. In this way, access holes to the silicon substrate are provided for contacts made of molybdenum, for example.

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Deposition in Recesses

This method is for depositing metals in recesses in solid surfaces. A metal salt-organic polymer solution is deposited on the solid surface. The solid piece is spun rapidly to throw off excess solution and to dry the coating. With continued spinning, the surface of the solid piece is washed with a solvent to remove the coating from the outer surfaces, leaving the metal, salt-loaded film in the recesses. Heating reduces the salt and sinters the metal into place while burning away any carbonaceous residue. The drawing shows a typical solid piece consisting of an epitaxial silicon layer with thermally grown silicon dioxide on it. A platinum film is deposited in the recesses. In this way, access holes to the silicon substrate are provided for contacts made of molybdenum, for example.

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