Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

High Density Memory

IP.com Disclosure Number: IPCOM000092028D
Original Publication Date: 1968-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Smith, JF: AUTHOR

Abstract

The device interconnects many narrow array strip lines, of the order of hundreds of lines per inch, on one high-density film memory to similar strip lines of another high-density film memory. These strip lines communicate between the film memory and outside driving circuits, logic circuits, etc.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 89% of the total text.

Page 1 of 2

High Density Memory

The device interconnects many narrow array strip lines, of the order of hundreds of lines per inch, on one high-density film memory to similar strip lines of another high-density film memory. These strip lines communicate between the film memory and outside driving circuits, logic circuits, etc.

In drawing A, main body portion 1 is made of a rigid plastic material which can be molded or extruded. There are two such main body portions. Four grooves 2, two in the upper body portion and two in the lower body portion, are provided in which are placed 0-ring sections 3 of neoprene or the like. Sections 3 apply spring-like pressure to interconnection pad assembly 5 comprising elements 6, 7, 10, and 11 as in drawing C.

Element 6 is a lamination of epoxy glass on which is deposited printed interconnecting lines 7. Element 10 is also an interconnecting copper strip and is insulated from interconnecting lines 7 by epoxy glass section 11.

Assembly 5 connects to two ground planes 9, each of which supports an array of transmission lines 8. Prior to inserting planes 9 into assembly 5, the two main epoxy portions 1 are in the unlocked position as in drawing C. When planes 9 are inserted into their respective main body portions, lines 7 connect to corresponding lines 8. Epoxy glass 6 has two locating lips 6' which fit into and are glued to slots 4 in the main body of the device. When cam 12 is turned to its closing position, the 0-rings urge assembly 5 agains...