Browse Prior Art Database

Snap On Nucleate Boiling Promoter

IP.com Disclosure Number: IPCOM000092034D
Original Publication Date: 1968-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

This device is made of material which allows it to be easily snapped on at a particular surface to provide an improved heat transfer interface between the surface and the liquid in which it is immersed. The snap-on material is such that increased nucleate boiling takes place thus realizing a more efficient heat transfer.

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Snap On Nucleate Boiling Promoter

This device is made of material which allows it to be easily snapped on at a particular surface to provide an improved heat transfer interface between the surface and the liquid in which it is immersed. The snap-on material is such that increased nucleate boiling takes place thus realizing a more efficient heat transfer.

In this liquid boiling system for cooling, components 12 are mounted on heat sink type studs 14. The latter are immersed in a low-boiling point liquid 16 such that heat is removed from studs 14 by nucleate boiling. Oftentimes, components 12, to be cooled, operate at different power levels and thus generate different amounts of heat which must be dissipated. Thus, different size heat sink studs or fins provide more surface area for heat transfer between the liquid and stud.

This arrangement allows studs 14 to be the same size. Those components 12a and 12b which require greater heat dissipation have nucleate boiling promoter devices 18a and 18b snapped onto studs 14 so that enhanced nucleate boiling takes place. Thus the amount of heat transferred from a stud 14 to cooling liquid 16 is increased. For example, promoters 18a and 18b can be made of *TEFLON having many pores so that the metallic areas of studs 14, exposed through the pores of the TEFLON provide nucleation sites. Different size promoters 18a and 18b can be utilized depending upon the amount of heat to be dissipated. Thus, medium power component 12a has...