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Shutter and Actuating Mechanism for High Vacuum Sputtering Chambers

IP.com Disclosure Number: IPCOM000092053D
Original Publication Date: 1968-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Donald, GW: AUTHOR [+3]

Abstract

The apparatus shields the cathode from foreign material discharged from the anode during reverse sputtering operations.

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Shutter and Actuating Mechanism for High Vacuum Sputtering Chambers

The apparatus shields the cathode from foreign material discharged from the anode during reverse sputtering operations.

During sputtering operations, prior to actual sputtering, a reverse sputtering operation is required to insure clean wafer surfaces. Foil shutter 10 of aluminum or stainless steel foil is mounted on roller 12 which is maintained under tension by spring motor 14. Roller 16 whose lower periphery coincides with the plane through which shutter 10 passes between anode 18 and cathode 20 is also located on the frame. Shutter 10 is passed down and around roller 16. The leading edge of shutter 10 is attached to flat bar 22 across its width by spring clips. The bar in turn is mounted through blocks to a V-formed spring 24. The V- form along the entire length of spring 24 provides axial rigidity but still allows the spring to be rolled on drum 26. Cantilevering spring 24 through two formed, spring-loaded rollers 28, provides for extending and retracting shutter 10 in an area of limited space without additional supports in the glow discharge area.

During normal sputtering operations, shutter 10 remains in retracted position on roller 12 out of the glow discharge area. When it is desired to reverse sputter, drum 26, containing spring 24, is rotated to unwind spring 24. As the latter is driven from drum 26 through support rollers 28, it returns to its natural straightness and pushes bar 22 to...