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Direct Deposition Technique

IP.com Disclosure Number: IPCOM000092064D
Original Publication Date: 1968-Aug-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cutillo, JG: AUTHOR

Abstract

A rapid technique for depositing polymeric films onto a metal substrate is accomplished by wetting selected portions of a metal substrate in a 10% sulfuric acid solution. The acid treated substrate is then immersed in a base-stabilized organic emulsion. The organic material coagulates from the emulsion and strongly adheres to the acid-treated portion of the substrate. Upon removal of the substrate from the emulsion, the coagulate is cured in an oven at 150 degrees C for about 15 minutes. The resultant polymeric film is uniformly deposited in the selected areas and adheres very strongly to the metal substrate. A base-stabilized organic emulsion which can be used in the above method is an aqueous emulsion of an alkyd amine prepared by Mobile Company, Inc., and is marketed under the trade name of IR-1540.

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Direct Deposition Technique

A rapid technique for depositing polymeric films onto a metal substrate is accomplished by wetting selected portions of a metal substrate in a 10% sulfuric acid solution. The acid treated substrate is then immersed in a base-stabilized organic emulsion. The organic material coagulates from the emulsion and strongly adheres to the acid-treated portion of the substrate. Upon removal of the substrate from the emulsion, the coagulate is cured in an oven at 150 degrees C for about 15 minutes. The resultant polymeric film is uniformly deposited in the selected areas and adheres very strongly to the metal substrate. A base-stabilized organic emulsion which can be used in the above method is an aqueous emulsion of an alkyd amine prepared by Mobile Company, Inc., and is marketed under the trade name of IR-1540. An acid-stabilized emulsion can also be used. In the case of an acid-stabilized emulsion, the substrate is pretreated in a base which causes coagulation of the organic material. This method provides a rapid technique for direct deposition of polymeric films onto a metal substrate. It is also nonflammable and non-toxic.

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