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Metalizing Photographic Images

IP.com Disclosure Number: IPCOM000092117D
Original Publication Date: 1968-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Ladd, RS: AUTHOR

Abstract

Silver halides act as a catalyst for depositing metal, such as copper, from a plating solution. Thus, metallic patterns can be formed using photographic materials and techniques. Such metallic patterns can be used to produce printed circuits.

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Metalizing Photographic Images

Silver halides act as a catalyst for depositing metal, such as copper, from a plating solution. Thus, metallic patterns can be formed using photographic materials and techniques. Such metallic patterns can be used to produce printed circuits.

A process for making a printed circuit comprises forming relief images 10 of a circuit pattern in the form of unexposed silver halide emulsion on film substrate 11 using the reverse etch technique. After washing in water, film 12 is immersed in a copper electroless plating solution to deposit metallic layer 13 on images 10. Because of the catalytic action of the silver halide compounds, copper is deposited over the unexposed emulsion.

For example, a positive pattern of circuity is contact-printed on Kodak Type III ortho film having a .004 inch Estar base. After development in Hunt's Starlith developer for three minutes, the exposed film is rinsed in running water and etched in Kodak EB-4 etch solution until all exposed and developed areas are removed from base 11. Following washing in water for five minutes, the film 12 is immersed in an electroless copper plating bath, 97A + 97B Shipley, with no agitation for 30 minutes. The plating bath consisted of one part 97B, two parts 97A, and 4.75 parts of distilled water, the mixture remaining at room temperature. After deposition, plated film 12 is washed in running water and then dried. A printed circuit is produced having a conductive pattern .0004...