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Bonding Electroless Metal to Epoxy

IP.com Disclosure Number: IPCOM000092139D
Original Publication Date: 1968-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Elmore, GV: AUTHOR

Abstract

In the manufacture of printed circuit boards, an adhesive layer of another material between the epoxy and electroless metal has undesirable properties. This process is for bonding electroless metal directly to an epoxy without requiring the use of an adhesive layer between the two materials.

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Bonding Electroless Metal to Epoxy

In the manufacture of printed circuit boards, an adhesive layer of another material between the epoxy and electroless metal has undesirable properties. This process is for bonding electroless metal directly to an epoxy without requiring the use of an adhesive layer between the two materials.

Starting with a bare epoxy board laminated with TEDLAR* release sheets, the following process steps are followed. 1. Clean board by immersing for 5 minutes in an alkaline cleaner at 60 degrees C and water rinse. 2. Dry board by baking for 5 minutes at 170 degrees C. 3. Coat board to a thickness of 0.00016 with epoxy by immersing for 2 minutes in a 20% chloride solution,

Sp Gr - 1.28, and then withdraw at a rate of 4 inches

per second. Sixty per cent FR - 4 epoxy is heated for

two hours at 90 degrees C in water bath with stirring,

cooled, and diluted with methylene chloride to 20 per cent

solids content, Sp Gr - 1.28. 4. Remove solvent and start curing by baking board at 115 degrees C for 5 minutes. 5. Make surface of board water wettable by immersing the board for one minute in a SnCl(2) - HCl, solution

and water rinse. Use 15 g of SnCl(2). H(2)O per liter

of solution and 3.3 ml concentrated HCl per liter of

solution. 6. Cover surface with CaCO(3) particles by dipping in a CaCO(3) water slurry, 300 g per liter of CaCO(3).

Withdraw at a rate of 2 inches per second. Use 300 g per

liter of CaCO(3) in water suspension. Light precipitated

CaCO(3)...