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Browse Prior Art Database

Heat Sink

IP.com Disclosure Number: IPCOM000092143D
Original Publication Date: 1968-Sep-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Haist, F: AUTHOR [+2]

Abstract

Semiconductor chips are normally disposed on the top layer of multilayer modules so that there is a poor heat transfer to the substrate. To improve the heat flow over the module conducting patterns embedded in glass, the glass insulating layer of the module comprises a heat-conducting network which is led to the outside and linked with the Al(2)O(3) substrate. Additionally, the top glass layer is provided with a metal coating leaving free the respective chips. The metal coating is also connected to the Al(2)O(3) substrate. This ensures that the heat flow from the respective chips through the landpads is for the greatest part routed over the surface. By grounding the metal coating and the heat-conducting network, the internal conducting patterns can be screened from each other.

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Heat Sink

Semiconductor chips are normally disposed on the top layer of multilayer modules so that there is a poor heat transfer to the substrate. To improve the heat flow over the module conducting patterns embedded in glass, the glass insulating layer of the module comprises a heat-conducting network which is led to the outside and linked with the Al(2)O(3) substrate. Additionally, the top glass layer is provided with a metal coating leaving free the respective chips. The metal coating is also connected to the Al(2)O(3) substrate. This ensures that the heat flow from the respective chips through the landpads is for the greatest part routed over the surface. By grounding the metal coating and the heat-conducting network, the internal conducting patterns can be screened from each other.

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