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Making Circuit Laminate with Through Pins

IP.com Disclosure Number: IPCOM000092200D
Original Publication Date: 1968-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Sarachinsky, B: AUTHOR

Abstract

This process produces a continuous strip of copper-dielectric laminate with raised interconnecting pins suitable for use in printed circuit technology. Copper sheet 1 is pressed and coined between rollers 2 and 3 to form swaged pins 4 on such sheet. The latter next passes between heated pressure roll 5 and dielectric feed and pressure roll 6 to bond dielectric 7 to sheet 1. The laminated assembly is fed beneath sanding belt 8 to remove a sufficient quantity of the dielectric to expose the tips of pins 4. The copper side of the laminate is suitable for etching to produce printed circuits. Multilayer packages can be manufactured by stacking these circuit planes in their required positions. Circuit continuity is completed by solder reflow welding, drilling and pinning or other methods.

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Making Circuit Laminate with Through Pins

This process produces a continuous strip of copper-dielectric laminate with raised interconnecting pins suitable for use in printed circuit technology. Copper sheet 1 is pressed and coined between rollers 2 and 3 to form swaged pins 4 on such sheet. The latter next passes between heated pressure roll 5 and dielectric feed and pressure roll 6 to bond dielectric 7 to sheet 1. The laminated assembly is fed beneath sanding belt 8 to remove a sufficient quantity of the dielectric to expose the tips of pins 4. The copper side of the laminate is suitable for etching to produce printed circuits. Multilayer packages can be manufactured by stacking these circuit planes in their required positions. Circuit continuity is completed by solder reflow welding, drilling and pinning or other methods.

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