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Browse Prior Art Database

Laser Induced Plated Through Holes

IP.com Disclosure Number: IPCOM000092224D
Original Publication Date: 1968-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Potts, HR: AUTHOR [+2]

Abstract

Machining and plating of holes through substrates can be accomplished substantially simultaneously by this structure. Laser beam 1 is generated by lasing device 9 under control of switch 12 connected to power supply 14. Focusing arrangement 2 and 2a directs beam 1 against substrate 3 which has evaporable backing 4, principally a noble metal. Stage 5, upon which the substrate 3 is held, is adjustable to control the depth of focus of beam 1. The latter is usually focused at some point within substrate 3 to cause expulsion of material followed by an expulsion of evaporable layer 4 which is in a vaporized state and condenses on the surfaces of the machined hole, thus resulting in a plated through-hole.

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Laser Induced Plated Through Holes

Machining and plating of holes through substrates can be accomplished substantially simultaneously by this structure. Laser beam 1 is generated by lasing device 9 under control of switch 12 connected to power supply 14. Focusing arrangement 2 and 2a directs beam 1 against substrate 3 which has evaporable backing 4, principally a noble metal. Stage 5, upon which the substrate 3 is held, is adjustable to control the depth of focus of beam 1. The latter is usually focused at some point within substrate 3 to cause expulsion of material followed by an expulsion of evaporable layer 4 which is in a vaporized state and condenses on the surfaces of the machined hole, thus resulting in a plated through-hole.

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