Browse Prior Art Database

Tweezer for Handling Semiconductor Wafers

IP.com Disclosure Number: IPCOM000092284D
Original Publication Date: 1968-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Malone, RH: AUTHOR

Abstract

A pair of tweezers is modified by making two right angle bends near the tweezer tips. This prevents damage to active semiconductor surfaces on silicon wafers by restricting tweezer contact to the wafer edges. A pair of tweezers 10 has first and second right angle bends 12 and 14 near the tweezer tips 16. When the tweezers are used to grasp semiconductor wafer 18, tips 16 cannot contact the center of the wafer. The opposing horizontal portions of tips 16, though limited in the amount of wafer 18 they can contact, provide positive gripping of such wafer.

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Tweezer for Handling Semiconductor Wafers

A pair of tweezers is modified by making two right angle bends near the tweezer tips. This prevents damage to active semiconductor surfaces on silicon wafers by restricting tweezer contact to the wafer edges. A pair of tweezers 10 has first and second right angle bends 12 and 14 near the tweezer tips 16. When the tweezers are used to grasp semiconductor wafer 18, tips 16 cannot contact the center of the wafer. The opposing horizontal portions of tips 16, though limited in the amount of wafer 18 they can contact, provide positive gripping of such wafer.

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