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Dimensionally Stable and Warp Free Laminates

IP.com Disclosure Number: IPCOM000092301D
Original Publication Date: 1968-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ellis, TL: AUTHOR

Abstract

Limited control over dimensional changes and warpage of laminates can be obtained by using planishing plates having a coefficient of expansion either greater or less than the material being laminated. The metal used for the planishing plates depends upon the characteristics of the laminated materials. In the lamination of a core of copper and epoxy impregnated glass cloth, planishing plates are used which have a coefficient of expansion greater than the copper and glass. If layers of copper and glass cloth are subsequently added to the core, the planishing plates are changed to a metal having a coefficient of expansion equal to or less than the composite laminate. This process decreases warpage and reduces dimensional changes resulting from processing.

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Dimensionally Stable and Warp Free Laminates

Limited control over dimensional changes and warpage of laminates can be obtained by using planishing plates having a coefficient of expansion either greater or less than the material being laminated. The metal used for the planishing plates depends upon the characteristics of the laminated materials. In the lamination of a core of copper and epoxy impregnated glass cloth, planishing plates are used which have a coefficient of expansion greater than the copper and glass. If layers of copper and glass cloth are subsequently added to the core, the planishing plates are changed to a metal having a coefficient of expansion equal to or less than the composite laminate. This process decreases warpage and reduces dimensional changes resulting from processing. Metals useful as planishing plates are steel, stainless steel, aluminum and beryllium copper.

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