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Etching with Combined High and Low Frequency Agitation

IP.com Disclosure Number: IPCOM000092302D
Original Publication Date: 1968-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Butora, JA: AUTHOR [+2]

Abstract

Material removal by etching can be accomplished at a faster rate and with less undercutting by vibrating the workpiece in an etching solution while simultaneously agitating the solution at an ultrasonic frequency. Workpiece 1, fastened to vibrator 2, is immersed in etchant 3, held in container 4 that is vibrated ultrasonically by energy source 5.

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Etching with Combined High and Low Frequency Agitation

Material removal by etching can be accomplished at a faster rate and with less undercutting by vibrating the workpiece in an etching solution while simultaneously agitating the solution at an ultrasonic frequency. Workpiece 1, fastened to vibrator 2, is immersed in etchant 3, held in container 4 that is vibrated ultrasonically by energy source 5.

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