Browse Prior Art Database

Induction Stacking

IP.com Disclosure Number: IPCOM000092313D
Original Publication Date: 1968-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Willard, LA: AUTHOR

Abstract

Induction heating can be used in the fabrication of stacked integrated circuit modules. Fixture 10 has grooves 12 which hold substrates 14 in a stacked relationship. Pins 16 are held in the stacked assembly with their ends projecting inside coil 18. RF current is supplied to coil 18 by RF generator 20. Thus pins 16 are heated sufficiently to enable the formation of a solder reflow joint where pins 16 contact stacked substrates 14. The use of induction heating to form these solder joints enables them to be formed rapidly and essentially without heating substrates 14. Possible damage to integrated circuits on substrates 14 is therefore avoided.

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Induction Stacking

Induction heating can be used in the fabrication of stacked integrated circuit modules. Fixture 10 has grooves 12 which hold substrates 14 in a stacked relationship. Pins 16 are held in the stacked assembly with their ends projecting inside coil 18. RF current is supplied to coil 18 by RF generator 20. Thus pins 16 are heated sufficiently to enable the formation of a solder reflow joint where pins 16 contact stacked substrates 14. The use of induction heating to form these solder joints enables them to be formed rapidly and essentially without heating substrates 14. Possible damage to integrated circuits on substrates 14 is therefore avoided.

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