Browse Prior Art Database

Heat Transfer in a Liquid Cooling System

IP.com Disclosure Number: IPCOM000092316D
Original Publication Date: 1968-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Cohen, MG: AUTHOR [+3]

Abstract

Semiconductors 22 are mounted on one end of heat-conducting cooling studs 24 made of copper. Semiconductor carrying ends of studs 24 are connected to one aide of a circuit board. This forms one wall 14 of narrow channel 18 through which cooling liquid 20 is forced to flow. Studs 24 extend from wall 14 to channel 18 in spaced relationship with respect to one another. Further studs 28, connected to the opposite wall 16, extend into channel 18, parallel to studs 24 and in spaced, staggered relationship. Further studs 28 cause an increase in turbulence of flowing liquid around studs 24 and direct flow of cooling liquid 20 over a greater area of studs 24, thus increasing heat transfer from them.

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Heat Transfer in a Liquid Cooling System

Semiconductors 22 are mounted on one end of heat-conducting cooling studs 24 made of copper. Semiconductor carrying ends of studs 24 are connected to one aide of a circuit board. This forms one wall 14 of narrow channel 18 through which cooling liquid 20 is forced to flow. Studs 24 extend from wall 14 to channel 18 in spaced relationship with respect to one another. Further studs 28, connected to the opposite wall 16, extend into channel 18, parallel to studs 24 and in spaced, staggered relationship. Further studs 28 cause an increase in turbulence of flowing liquid around studs 24 and direct flow of cooling liquid 20 over a greater area of studs 24, thus increasing heat transfer from them. A dummy stud can be attached to wall 16 at a position where a stud 24 is not included on wall 14 to provide a balanced flow conditions in channel 18. When packing density is to be increased, wall 16 is substituted for a circuit board, in which components are mounted on one end of turbulator studs acting as cooling studs.

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