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Browse Prior Art Database

Selective Plating Technique

IP.com Disclosure Number: IPCOM000092323D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Gaudet, FC: AUTHOR [+3]

Abstract

A process is provided for electroplating one set of pins on a board having conductive pins protruding from both surfaces. Board 2 containing pins 4 and 6, shown in A is taken and encapsulated in housing 8, shown in B, containing electrolyte 10 and cathode 12. Housing 8 is then immersed in vat 14, shown in C, also containing electrolyte 10 and anode 16. Upon activation of the cell, pins 4 are plated while pins 6 are not.

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Selective Plating Technique

A process is provided for electroplating one set of pins on a board having conductive pins protruding from both surfaces. Board 2 containing pins 4 and 6, shown in A is taken and encapsulated in housing 8, shown in B, containing electrolyte 10 and cathode 12. Housing 8 is then immersed in vat 14, shown in C, also containing electrolyte 10 and anode 16. Upon activation of the cell, pins 4 are plated while pins 6 are not.

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