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Vitreous Frit for Conductive Metallizing Composition

IP.com Disclosure Number: IPCOM000092330D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR [+2]

Abstract

This frit, used in fired electrodes formed on an insulating substrate, combines good adhesion to the substrate with excellent tinnability.

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Vitreous Frit for Conductive Metallizing Composition

This frit, used in fired electrodes formed on an insulating substrate, combines good adhesion to the substrate with excellent tinnability.

Electrodes are formed by applying to and then firing on an alumina ceramic substrate a conductive metallizing paste of solid constituents mixed with an inert liquid vehicle. The solids normally comprise noble metal particles dispersed in a vitreous frit. The noble metal particles when fired, provide the required conductivity. The vitreous frit is included to bind the conductive particles together and to the substrate. Since these electrodes are normally subsequently coated with solder so as to increase conductivity and permit joining of devices to them, frit materials are chosen which do not interfere with the tinning process.

For optimum tinnability combined with adequate adhesion there are minimal quantities of the higher melting structural oxides such as Al(2) O(3), B(2)O(3), and SiO(2), since these tend to interfere most with soldering. However, some minimal quantity of these materials is necessary since they form the structure of the glass and therefore lend the cohesion and adhesion to the composition.

The frit includes a maximum of easily reduced oxides such as bismuth oxide, lead oxide, cadmium oxide, vanadium oxide, etc. When fluxed with common solder fluxes such as abietic acid, these oxides can be reduced on the electrode surface and therefore permit the solder to...