Browse Prior Art Database

Monolithic Circuit Package

IP.com Disclosure Number: IPCOM000092340D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Betz, RJ: AUTHOR

Abstract

This method is for fixing monolithic chips 10 mounted on chip carriers 14 to multilayer ceramic card 12. Chips 10 are mounted on chip carriers 14 in two different ways. In drawing A the exposed chip 10 is mounted balls down on chip carrier 14. In drawing B a chip 10 is bonded to a molybdenum stud 16 and inserted through an opening in ceramic carrier 14. Then hermetically sealed cover 18 is mounted on the underside of the assembly to encapsulate the chip 10. Pins 20 which extend downwardly from carrier 14 are positioned in metalized pockets 22 in card 12. These pockets 22 are then filled with solder 24 to form solder buckets. Card 12 with chips 10 on it is passed through an oven to reflow solder 24 in the bucket to pins 20.

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Monolithic Circuit Package

This method is for fixing monolithic chips 10 mounted on chip carriers 14 to multilayer ceramic card 12. Chips 10 are mounted on chip carriers 14 in two different ways. In drawing A the exposed chip 10 is mounted balls down on chip carrier 14. In drawing B a chip 10 is bonded to a molybdenum stud 16 and inserted through an opening in ceramic carrier 14. Then hermetically sealed cover 18 is mounted on the underside of the assembly to encapsulate the chip
10. Pins 20 which extend downwardly from carrier 14 are positioned in metalized pockets 22 in card 12. These pockets 22 are then filled with solder 24 to form solder buckets. Card 12 with chips 10 on it is passed through an oven to reflow solder 24 in the bucket to pins 20. Carrier 14 replacement can be accomplished by a tool that heats pins 20 for both extraction and insertion.

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