Browse Prior Art Database

Alternative Bonding Pad

IP.com Disclosure Number: IPCOM000092341D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Wu, WW: AUTHOR

Abstract

Small contact areas 10 adjacent monolithic lines 12 at test sites prevent damage to lines 12. The latter on monolithic chips are quite narrow and when circuitry is bonded to them for testing, the lines 12 are destroyed or torn. To minimize destruction of the lines, a number of contact areas 10 can be added adjacent the line. These contact areas 10 increase the strength of the bond while not affecting the circuit's performance since they do not add stray capacitance to the circuit.

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Alternative Bonding Pad

Small contact areas 10 adjacent monolithic lines 12 at test sites prevent damage to lines 12. The latter on monolithic chips are quite narrow and when circuitry is bonded to them for testing, the lines 12 are destroyed or torn. To minimize destruction of the lines, a number of contact areas 10 can be added adjacent the line. These contact areas 10 increase the strength of the bond while not affecting the circuit's performance since they do not add stray capacitance to the circuit.

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