Browse Prior Art Database

Component Quick Change Machine

IP.com Disclosure Number: IPCOM000092346D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Kurbaba, MR: AUTHOR

Abstract

Rapidly removing, replacing and repositioning components on printed circuit cards are realized by simultaneously heating all the leads of a single component in this machine. The latter, drawing A, consists of support table 1 mounted on rails 2, 3, 4, and 5 so that such table can be positioned in X-Y directions. Table 1 is adapted to hold one of a series of templates 6 provided with cutouts for different circuit boards 7 that are fastened in it. Standard wave-solder pot 8, drawing B, provided with a T-shaped top opening, is positioned beneath template 6. Location indicator 9, mounted above template 6, serves to guide component removal and insertion tool 10 and to properly locate the circuit component over solder pot 8.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 95% of the total text.

Page 1 of 2

Component Quick Change Machine

Rapidly removing, replacing and repositioning components on printed circuit cards are realized by simultaneously heating all the leads of a single component in this machine. The latter, drawing A, consists of support table 1 mounted on rails 2, 3, 4, and 5 so that such table can be positioned in X-Y directions. Table 1 is adapted to hold one of a series of templates 6 provided with cutouts for different circuit boards 7 that are fastened in it. Standard wave-solder pot 8, drawing B, provided with a T-shaped top opening, is positioned beneath template
6. Location indicator 9, mounted above template 6, serves to guide component removal and insertion tool 10 and to properly locate the circuit component over solder pot 8.

A compressor tool, not shown, is interchangeable with tool 10 in indicator 9 when it is desired to reseat tipped components.

A component to be removed has flux applied to the solder connections prior to insertion of board 7 in template 6. Table 1 is moved to properly position the component over the solder wave 11 when the removal tool 10 is properly seated in the slot in indicator 9 and has engaged component 12. Solder wave 11 is activated and component 12 is removed by pulling upward on tool 10. To replace a component, it is inserted in tool 10 and the solder wave unit is reactivated to flow solder over the area. Tipped components are resoldered by a similar method while pressure is applied to the top of the component...