Browse Prior Art Database

Solderable Pins by Scoring

IP.com Disclosure Number: IPCOM000092347D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Chapman, RM: AUTHOR

Abstract

Improvement in solder retention of module pins under high-temperature module processing is attained by axially scoring their circumferences. Upon tinning these pins, a build-up of solder forms. Such build-up, under heating processes such as chip joining or encapsulation, prevents the completion of compound reaction maintaining adequate solderability, for subsequent second-level card mounting.

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Solderable Pins by Scoring

Improvement in solder retention of module pins under high-temperature module processing is attained by axially scoring their circumferences. Upon tinning these pins, a build-up of solder forms. Such build-up, under heating processes such as chip joining or encapsulation, prevents the completion of compound reaction maintaining adequate solderability, for subsequent second- level card mounting.

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