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Browse Prior Art Database

Improved Metallurgy for Ceramics

IP.com Disclosure Number: IPCOM000092349D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Ahn, J: AUTHOR [+4]

Abstract

An improvement is made to thick-film conductors by incorporating relatively small quantities of metals which melt during firing. The conductivity and density of the fired lands are improved. Typically, such metallizing compositions are applied in paste form by screening onto such dielectric materials as ceramics. The wet paste is dried and then fired to bond it to the substrate. The firing temperature is generally lower than that of the melting point of the normal metals in the composition to prevent discontinuities in the fired pattern. However, if relatively small quantities of metals are included in the formulation which do melt during the firing, appreciable improvements in conductivity and land density are achieved. Three specific embodiments demonstrate this method.

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Improved Metallurgy for Ceramics

An improvement is made to thick-film conductors by incorporating relatively small quantities of metals which melt during firing. The conductivity and density of the fired lands are improved. Typically, such metallizing compositions are applied in paste form by screening onto such dielectric materials as ceramics. The wet paste is dried and then fired to bond it to the substrate. The firing temperature is generally lower than that of the melting point of the normal metals in the composition to prevent discontinuities in the fired pattern. However, if relatively small quantities of metals are included in the formulation which do melt during the firing, appreciable improvements in conductivity and land density are achieved. Three specific embodiments demonstrate this method.

Copper is combined with Mo and Mn in a metallizing system. Finely divided powders of Mo/Mn/Cu are dispersed in an organic vehicle to make a paste which when fired at about 1285 degrees C, particularly in the internal metallizing in multilayer ceramic structures, produces distinct improvement in the resulting fired land conductivity when compared with normal Mo/Mn metallizing. A ratio of Mo/Mn/Cu of 47.5% : 2.5% : 50% can be used.

In another embodiment, up to 10% antimony metal can be added to a formulation containing 80 parts of silver to 20 parts palladium. When this composition is fired at about 800 degrees C in an atmosphere which prevents the oxidation of the...