Browse Prior Art Database

High Density Packaging of Monolithic Circuits

IP.com Disclosure Number: IPCOM000092351D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Agusta, B: AUTHOR [+3]

Abstract

This packaging method increases the packaging density of circuit chips by an order of magnitude. The method generally involves mounting chips on chip carriers in a position generally transverse to the module substrate. The arrangement in drawing A has module substrate 10 provided with pins 12, a printed conductive land pattern 14 on the top surface 15 of 10, and a plurality of transversely positioned chip carriers 16. The latter are electrically connected to each other and pattern 14 by conductors 18. A chip 20, or other electronic component, is mounted on each carrier 16 and joined to a printed circuit pattern 22.

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High Density Packaging of Monolithic Circuits

This packaging method increases the packaging density of circuit chips by an order of magnitude. The method generally involves mounting chips on chip carriers in a position generally transverse to the module substrate. The arrangement in drawing A has module substrate 10 provided with pins 12, a printed conductive land pattern 14 on the top surface 15 of 10, and a plurality of transversely positioned chip carriers 16. The latter are electrically connected to each other and pattern 14 by conductors 18.

A chip 20, or other electronic component, is mounted on each carrier 16 and joined to a printed circuit pattern 22.

An alternate arrangement of chip carrier structures is shown at B. Carriers 30, provided with recesses 32 to receive chips 20, are assembled in abutting relation and transversely mounted on the module carrier not shown. Electrical contact between carriers 30 and the module substrate is established by printed solder circuits on the faces and edges of carriers 30.

The vertically mounted chip carrier method can be expanded to many carriers per module. The method can also serve as a mounting carrier for discrete components, i.e., passive devices, and special circuits interspersed between to serve as a good heat sink. This is effected by using material such as an insulated molybdenum slab or any high thermal conductivity insulator.

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