Browse Prior Art Database

Cold Flow Interconnection

IP.com Disclosure Number: IPCOM000092363D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Giedd, GR: AUTHOR [+2]

Abstract

Cold-flow interconnections of electronic apparatus can be made by tinning printed circuit cards with pure indium on the copper pattern. The properties of the soft indium metal are such that it cold-flows and cold-welds gaps between adjacent areas on the cards for interconnections. The interconnection pattern can be broken by coating the printed circuit card with flux and reflowing the indium. The surface tension of the metal draws it back to the original shape of the printed conductors. Such reflow can be done either throughout the full area or in a localized area.

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Cold Flow Interconnection

Cold-flow interconnections of electronic apparatus can be made by tinning printed circuit cards with pure indium on the copper pattern. The properties of the soft indium metal are such that it cold-flows and cold-welds gaps between adjacent areas on the cards for interconnections. The interconnection pattern can be broken by coating the printed circuit card with flux and reflowing the indium. The surface tension of the metal draws it back to the original shape of the printed conductors. Such reflow can be done either throughout the full area or in a localized area.

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