Browse Prior Art Database

Standoff Process for Modules

IP.com Disclosure Number: IPCOM000092364D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Stricker, AA: AUTHOR [+2]

Abstract

When standoffs are employed on connector pins in electronic apparatus, liquid encapsulants can travel by capillary action along the tool marks produced by the swaging operation. Where the swaging is done prior to tinning, a concavity of tinning material is formed within the sharp swaged junction in a pin, thus eliminating a flue-type arrangement which permits capillary action.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Standoff Process for Modules

When standoffs are employed on connector pins in electronic apparatus, liquid encapsulants can travel by capillary action along the tool marks produced by the swaging operation. Where the swaging is done prior to tinning, a concavity of tinning material is formed within the sharp swaged junction in a pin, thus eliminating a flue-type arrangement which permits capillary action.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]