Browse Prior Art Database

Interface for Thermal Exchange Devices

IP.com Disclosure Number: IPCOM000092381D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Ecker, ME: AUTHOR

Abstract

A flexible diaphragm 10, having plated through-holes 12 joining conductive areas 14 on opposite sides of the diaphragm, can be used as a conformal interfacing between a cooling liquid 16 and an irregularly shaped object 18 to be cooled. A thin dielectric material of high resiliency is electrolessly copperplated on both surfaces. Holes 12 are stamped or drilled through this material before or after the electroless plating process. Holes 12 are filled with a conductive substance such as solder or conductive epoxy paste and then wiped flush. Then both surfaces are plated again. The surface used to contact the solid is plated with a harder plating material such as nickel. Then both surfaces are coated with a photoresist, masked and photoetched to provide suitable circular paths 14 on either side of plated through-holes 12.

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Interface for Thermal Exchange Devices

A flexible diaphragm 10, having plated through-holes 12 joining conductive areas 14 on opposite sides of the diaphragm, can be used as a conformal interfacing between a cooling liquid 16 and an irregularly shaped object 18 to be cooled. A thin dielectric material of high resiliency is electrolessly copperplated on both surfaces. Holes 12 are stamped or drilled through this material before or after the electroless plating process. Holes 12 are filled with a conductive substance such as solder or conductive epoxy paste and then wiped flush. Then both surfaces are plated again. The surface used to contact the solid is plated with a harder plating material such as nickel. Then both surfaces are coated with a photoresist, masked and photoetched to provide suitable circular paths 14 on either side of plated through-holes 12.

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