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Browse Prior Art Database

Fabrication of Multilevel Ceramic Microelectronic Structures

IP.com Disclosure Number: IPCOM000092399D
Original Publication Date: 1967-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Schiller, JM: AUTHOR

Abstract

The use of a photoreactive binder permits fabrication of multilevel ceramic, microelectronic structures by photoforming techniques.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 56% of the total text.

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Fabrication of Multilevel Ceramic Microelectronic Structures

The use of a photoreactive binder permits fabrication of multilevel ceramic, microelectronic structures by photoforming techniques.

Multilevel ceramic microelectronic structures are fabricated by forming a slip containing a high percentage of ceramic particulate dispersed in a photoreactive binder and solvent. The binder includes a polyvinyl acetate homopolymer emulsion stabilized with a water sensitive protective colloid, e. g., polyvinyl alcohol, and sensitized with di-or tetrazonium compounds and aldehyde/azo condensed products to become photoreactive. The solvent is water. The slip is then deposited, as by casting, extrusion and the like, on an impervious surface and spread and leveled into thin films, typically 2...8 mils thick, and dried.

By using a photoplate defining a desired pattern, and upon exposure to an energy source such as a carbon arc, mercury lamp, laser or electron beam, the films photoreact, polymerize or otherwise react to become insensitive or insoluble to a developer. By the use of matched photoplates and exposure of both surfaces, the films react through their entire thickness. Water is then used as the developer to remove the unreacted material. In this manner, via holes, through holes, and channels defining desired circuit patterns are formed. Metallization is deposited in the via holes and channels. The films are then stacked in registry and laminated into a monolithic structu...