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Aluminum To Aluminum Bonding Process

IP.com Disclosure Number: IPCOM000092488D
Original Publication Date: 1966-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Chiou, C: AUTHOR [+2]

Abstract

In an aluminum-to-aluminum bonding process, the addition of a small amount of magnesium to one of the aluminum members significantly improves the character of the bond. Supporting insulating substrate 11 has a plurality of cavities 12 only one of which is shown. Screened aluminum lands 13 are formed on the top surface of substrate 11. Lands 13 are located about the top edges of cavity 12 and extend outwardly from it.

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Aluminum To Aluminum Bonding Process

In an aluminum-to-aluminum bonding process, the addition of a small amount of magnesium to one of the aluminum members significantly improves the character of the bond. Supporting insulating substrate 11 has a plurality of cavities 12 only one of which is shown. Screened aluminum lands 13 are formed on the top surface of substrate 11. Lands 13 are located about the top edges of cavity 12 and extend outwardly from it.

Disposed within cavity 12 is semiconductor chip device 14 which is bonded to substrate 11 by layer 15 formed at the bottom of cavity 12. Chip 14 is provided with a plurality of vacuum deposited aluminum contacts 16. The latter are formed through suitable openings in a glass protecting layer formed on chip 14.

To form an electric connection between contacts 16 and lands 13 a plurality of conductive wires 17 is laid between each contact and its respective land. Bonding tip 18 of a thermocompression or ultrasonic bonder is contacted to a wire 17 over land 13 until a bond is established. Then tip 18 is relocated to establish a bond between the opposite end of wire 17 and contact 16.

Previous attempts at an all-aluminum conductor system in which the wire is also made of aluminum, have limited success due to difficulties encountered in the aluminum-to-aluminum bonding process. With thermocompression bonding the bond can only be achieved in a very narrow temperature range. A slight deviation results in a poor bond or no...