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Browse Prior Art Database

Wafer Dicing Apparatus

IP.com Disclosure Number: IPCOM000092501D
Original Publication Date: 1966-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Black, AR: AUTHOR [+2]

Abstract

Silicon wafer 10 is attached by waxing, or the like, to carrier sheet 11 formed from bendable material such as brass. Wafer 10 is then scribed with a grid pattern in preparation for dicing.

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Wafer Dicing Apparatus

Silicon wafer 10 is attached by waxing, or the like, to carrier sheet 11 formed from bendable material such as brass. Wafer 10 is then scribed with a grid pattern in preparation for dicing.

The dicing apparatus comprises die 12 having curved upper surface 13 mounted on support block 14. Frame 15, having handle 16, is pivoted at opposite ends to the center of the curvature of die 12.

Dicing roller 17 is rotatably supported between arms 18 of frame 15.

Web 19, such as plastic coated brass, is anchored at one end to the base of die 12. The other end of web 19 is wound around the periphery of roller 17. Torsion spring 20, anchored to frame 15 and roller 17, causes web 19 to wind up on roller 17 and biases frame 15 in counterclockwise direction. Wafer 10 is diced after scribing by placing wafer sheet 11 on the upper surface of die 12 with frame 15 in horizontal position.

Frame 15 is then rotated clockwise causing web 19 to become extended by unrolling from roller 17. The latter is mounted on frame 15 so that roller 17 is spaced slightly from the upper surface of die 12. As frame 15 is turned, roller 17 and web 19 contact sheet 11 causing it to begin bending around die 12. The moving of handle 16 causes web 19 to unroll from roller 17. The torque of spring 20 draws web 19 taut, which completes the bending of sheet 11 over die 12. When the entire wafer 10 is bent, frame 15 is rotated counterclockwise to horizontal position. Sheet 11 is removed, fl...