Browse Prior Art Database

Packaging Techniques

IP.com Disclosure Number: IPCOM000092530D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Hinkley, KS: AUTHOR [+4]

Abstract

Techniques for improving contact between mating members in circuit packaging are shown in drawings A and B.

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Packaging Techniques

Techniques for improving contact between mating members in circuit packaging are shown in drawings A and B.

Drawing A shows the use of conical or pyramidal surfaces of conductor pins projecting from a circuit board. Against these are urged corresponding configured female contacting surfaces on the projecting member's module or component. The advantage of this contact configuration is not only an improvement in the electrical contact characteristics but also in the ease in which alignment is facilitated by the opposed mating surfaces.

Drawing B shows another application for the conical configured end surfaces of pins in a modular assemblage. In this application, alignment of a central circuit board is facilitated by the use of a conical slug having female and male surfaces on opposing ends. In addition to achieving improvements in the alignment characteristics, electrical contacts can be selectively made between adjacently oriented pins on neighboring boards. Such is realized by using either a dielectric or a conductor material for the connector slug.

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