Browse Prior Art Database

Packaging Techniques

IP.com Disclosure Number: IPCOM000092531D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Hinkley, KS: AUTHOR [+4]

Abstract

Packaging techniques, as shown, provide flexibility and access to individual modules and circuit layers constituted of a dielectric sheet bearing various configurations of circuits including their connectors.

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Packaging Techniques

Packaging techniques, as shown, provide flexibility and access to individual modules and circuit layers constituted of a dielectric sheet bearing various configurations of circuits including their connectors.

In drawing A, the pin of a component or module makes contact with several circuit layers. A stiffener member may or may not be employed depending upon the number of circuit layers utilized and the rigidity required. Drawing B shows the technique for stacking circuit layers and establishing pin connections to them by virtue of the end configurations of the contacts on the circuit layer.

The technique in drawing C provides flexibility in establishing various types of interconnections between adjacent circuit layers in a multilayer assemblage. Interconnections to a common pin are made by way of the configured connections a, b and c. Connectors b and c have a further feature in establishing connections between themselves. Other circuit layers can be electrically isolated from the pin by virtue of the connector configurations e and f.

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