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Copper Polyethylene Terephthalate Laminate

IP.com Disclosure Number: IPCOM000092614D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Penoyer, RF: AUTHOR [+2]

Abstract

A process is provided for forming a copper polyethylene terephthalate laminate. A laminate is formed from copper and polyethylene terephthalate with a suitable adhesive being used to hold the copper to the polyethylene terephthalate. The laminate is then post-cured in an air atmosphere. Typical cure conditions require heating the laminate to a temperature of about 250 Degrees F for about 24 hours. Treating the laminate by this post-cure step results in an increase of the adhesion of the copper to the polyethylene terephthalate film.

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Copper Polyethylene Terephthalate Laminate

A process is provided for forming a copper polyethylene terephthalate laminate. A laminate is formed from copper and polyethylene terephthalate with a suitable adhesive being used to hold the copper to the polyethylene terephthalate. The laminate is then post-cured in an air atmosphere. Typical cure conditions require heating the laminate to a temperature of about 250 Degrees F for about 24 hours. Treating the laminate by this post-cure step results in an increase of the adhesion of the copper to the polyethylene terephthalate film.

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