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Flat Pack Soldering Machine

IP.com Disclosure Number: IPCOM000092615D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Radecke, T: AUTHOR [+3]

Abstract

The machine is for soldering flat packs onto printed cards. The machine establishes optimum electrical contacts between leads and pads and easy unsoldering of the module.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 58% of the total text.

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Flat Pack Soldering Machine

The machine is for soldering flat packs onto printed cards. The machine establishes optimum electrical contacts between leads and pads and easy unsoldering of the module.

First, the printed card with a tin-nickel plating protection is cleaned. Then, the precleaned card is coated with a solder cream, alpha 890 or equivalent, by positioning it in a stencil fixture provided with apertures. The latter register with the pad locations related to the flat pack leads. This stencil can be prepared from a standard MYLAR* sheet 0.007" thick. In order to harden the cream, the card is placed in a curing oven at 212 Degrees F for a period of twenty minutes. Such operation is omitted if, and only if, the flat packs are soldered to the card immediately after application of the cream.

The printed circuit card is positioned on the machine fixture using the two reference holes in the card and two corresponding guide pins in the fixture.

The prepared flat packs are arranged in a tray oriented in a manner so as to correspond with their correct positioning orientation on the printed circuit card, when positioned on the machine. The head when removed from the machine is used as a tool for selecting a flat pack from the tray. The arrangement of the head provides for a non-destructive suction of the flat pack case in order to transfer the same flat pack from the tray to the machine. A flat pack is selected with the head and is fixed to the movable machine posi...