Browse Prior Art Database

Vacuum Pick Up Device

IP.com Disclosure Number: IPCOM000092640D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Delgado, VJ: AUTHOR [+2]

Abstract

This vacuum pickup device facilitates article handling and to eliminate damage when transporting articles such as semiconductor wafers.

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Vacuum Pick Up Device

This vacuum pickup device facilitates article handling and to eliminate damage when transporting articles such as semiconductor wafers.

The device comprises metal tube 1 bent at the pickup end to which disposable tip 2 is adjustably attached. A vacuum source, not shown, is associated with the other end. In the lower drawing wafer 3 is picked up from the back side thus eliminating damage to the wafer surface.

For wafer release the vacuum is broken by applying a slight twist to the probe while in contact with a fixed surface.

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