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Thermal Monitoring Module

IP.com Disclosure Number: IPCOM000092644D
Original Publication Date: 1966-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Antonetti, VW: AUTHOR

Abstract

This monitoring module provides thermal protection to electronic modules which are being cooled. This module is positioned at a location where a predetermined temperature for the electronic modules cannot be exceeded. For duplicating the characteristics of the electronic modules, this monitoring module has the same outer case 11 as the electronic module and has the same heat generating property as the electronic module. The heating resistive material 13 under dielectric filler 14 generates the same heat as the electronic module and is supplied with current by pins 15 and 17. Thermally sensitive element 18 monitors the temperature of substrate 19 and is set to give a signal if the maximum allowable substrate temperature is reached. The signal pins 21 and 23 can be connected to an alarm or to shutdown devices.

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Thermal Monitoring Module

This monitoring module provides thermal protection to electronic modules which are being cooled. This module is positioned at a location where a predetermined temperature for the electronic modules cannot be exceeded. For duplicating the characteristics of the electronic modules, this monitoring module has the same outer case 11 as the electronic module and has the same heat generating property as the electronic module. The heating resistive material 13 under dielectric filler 14 generates the same heat as the electronic module and is supplied with current by pins 15 and 17. Thermally sensitive element 18 monitors the temperature of substrate 19 and is set to give a signal if the maximum allowable substrate temperature is reached. The signal pins 21 and 23 can be connected to an alarm or to shutdown devices.

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