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Nonelectrical Conductive, Resilient, Thermal Conductive Material

IP.com Disclosure Number: IPCOM000092646D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+3]

Abstract

This material provides resiliency in a layer which is to be used for heat-transfer from an irregular heat-generating electronic component to a flow of coolant. The material is thermally-conductive, electrically-insulating, and chemically inert. The particular material is, by weight, vinyl chloride, 13%; dioctyl phtalate plasticizer, 53%; and flake silver, 34%. Ease of electroplating this material without the usually required pretreatment is realized. To improve heat transfer, tn/lead, cadmium , nickel and gold can be thinly plated without affecting resiliency.

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Nonelectrical Conductive, Resilient, Thermal Conductive Material

This material provides resiliency in a layer which is to be used for heat- transfer from an irregular heat-generating electronic component to a flow of coolant. The material is thermally-conductive, electrically-insulating, and chemically inert. The particular material is, by weight, vinyl chloride, 13%; dioctyl phtalate plasticizer, 53%; and flake silver, 34%. Ease of electroplating this material without the usually required pretreatment is realized. To improve heat transfer, tn/lead, cadmium , nickel and gold can be thinly plated without affecting resiliency.

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