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Continuous Purification of Activator Bath for Electroless Copper Process

IP.com Disclosure Number: IPCOM000092654D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Durand, EA: AUTHOR [+3]

Abstract

The life of a palladium chloride activator bath for electroless copper deposition is prolonged by continuously removing copper dissolved in it. The activator bath is circulated through an ion exchange resin, e. g., the hydrogen form of a sulfonated polystyrene copolymer, to extract dissolved copper from the bath. Copper only is removed from the bath. Selective removal of copper by cationic exchange resins is possible since copper exists in solution as a cation, while palladium exists as a chloro palladium anion complex.

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Continuous Purification of Activator Bath for Electroless Copper Process

The life of a palladium chloride activator bath for electroless copper deposition is prolonged by continuously removing copper dissolved in it. The activator bath is circulated through an ion exchange resin, e. g., the hydrogen form of a sulfonated polystyrene copolymer, to extract dissolved copper from the bath. Copper only is removed from the bath. Selective removal of copper by cationic exchange resins is possible since copper exists in solution as a cation, while palladium exists as a chloro palladium anion complex.

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