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Etching Technique

IP.com Disclosure Number: IPCOM000092655D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Light, GS: AUTHOR [+2]

Abstract

Diffusion and migration occurs in moly base metallized ceramics during firing, causing sensitized areas for unwanted electroless deposition which, in turn, causes shorts between either pads or screened lines or both due to spotty plating. Spraying the surface metallization of the ceramic after firing and just prior to electroless plating with a moly etchant preferably K(3)Fe(CN)(6) potassium ferricyanide from one to two minutes, and rinsing in water, prepares the surface of the metallized ceramic for subsequent plating. The use of moly etchant K(3)Fe(CN)(6) potassium ferricyanide is advantageous in that it does not leave a residue to inhibit electroless plating operations, thus leaving a uniformly plated surface and eliminates spotty plating.

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Etching Technique

Diffusion and migration occurs in moly base metallized ceramics during firing, causing sensitized areas for unwanted electroless deposition which, in turn, causes shorts between either pads or screened lines or both due to spotty plating. Spraying the surface metallization of the ceramic after firing and just prior to electroless plating with a moly etchant preferably K(3)Fe(CN)(6) potassium ferricyanide from one to two minutes, and rinsing in water, prepares the surface of the metallized ceramic for subsequent plating. The use of moly etchant K(3)Fe(CN)(6) potassium ferricyanide is advantageous in that it does not leave a residue to inhibit electroless plating operations, thus leaving a uniformly plated surface and eliminates spotty plating.

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