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Preparation of High Dielectric Composites

IP.com Disclosure Number: IPCOM000092663D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Levy, MF: AUTHOR

Abstract

Electrical circuit board laminates having high dielectric compositions as AC decoupling layers between voltage and signal planes are prepared.

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Preparation of High Dielectric Composites

Electrical circuit board laminates having high dielectric compositions as AC decoupling layers between voltage and signal planes are prepared.

The laminates are prepared by coating metal substrates, for example, copper, with a high dielectric composition comprising a polysulfone resin and from about 60 to 85% by weight of BaTiO(3) in a suitable solvent. The coated substrates are placed coated surface to coated surface in a press and are subjected to heat and pressure to form the desired laminates.

The frequency-dielectric constant response of the laminates is reasonably uniform below 140 degrees C. Curie temperatures of most of the laminates are nonexistent below 140 degrees C. A properly prepared laminate is also stable to frequencies from 10KC to 10 MC and to thermal cycling from ambient temperatures 100 degrees C, 3 hours on and 3 hours off.

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