Browse Prior Art Database

High Dielectric Resin Matrix

IP.com Disclosure Number: IPCOM000092664D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Levy, MF: AUTHOR

Abstract

High dielectric laminates are prepared from a dielectric composition comprising a phenolic resin, cyanoethyl sucrose and BaTiO(3).

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High Dielectric Resin Matrix

High dielectric laminates are prepared from a dielectric composition comprising a phenolic resin, cyanoethyl sucrose and BaTiO(3).

The dielectric composition is prepared by compounding 30-60 parts of a phenolic resin vehicle, 30-60 parts cyanoethyl sucrose and the resin mixture is loaded to 85% with BaTiO(3). The compounded composition is coated on metal substrates. The coated substrates are placed coated surface to coated surface in a press and are subjected to heat and pressure to form the desired laminates.

The resultant laminate has a dielectric constant about 50% higher than when phenolic resin only is used in the preparation of the laminates.

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