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Impregnation of Porous Substrates

IP.com Disclosure Number: IPCOM000092665D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR [+9]

Abstract

Electrically conductive circuits are prepared by impregnating a metal-containing material into a porous substrate. The impregnated substrate is exposed to electron beam radiation.

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Impregnation of Porous Substrates

Electrically conductive circuits are prepared by impregnating a metal- containing material into a porous substrate. The impregnated substrate is exposed to electron beam radiation.

A saturated metal salt solution selected from the group of metal salts comprising cupric formate, cupric chloride, cupric nitrate, palladium chloride, silver nitrate, gold chloride, and polymer chelates prepared from the above salts, is imbibed into a porous substrate. Such can be, for example, polyamide paper, nonwoven glass cloth, glass cloth, ordinary paper and the like.

The saturated substrate is dried and excess metal saltis removed. The dried substrate is exposed to electron beam radiation under a desired pattern. Development of the desired conductive circuit is obtained by the removal of the unexposed metal salt by a solvent. To increase the conductive film thickness, the desired metal is electroplated onto the desired circuit. Alternately, where necessary, electroless plating of the metal can precede the electroplating step.

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