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Direct Circuit Deposition by Exposure of Metal Loaded Polymers to an Electron Beam

IP.com Disclosure Number: IPCOM000092680D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR [+5]

Abstract

Electrically conductive circuits are prepared by radiant energy induced deposition of a metal from metal alkyls oi metal carbonyls. These metallic compounds are subjected to thermal decomposition. Thus free metals and gaseous by-products are produced. For example, vaporous triisobutyl aluminum is passed over the surface of a substrate material which is placed in a vacuum system. The partial vapor pressure of the triisobutyl aluminum is maintained at about 10 mm of Hg or less.

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Direct Circuit Deposition by Exposure of Metal Loaded Polymers to an Electron Beam

Electrically conductive circuits are prepared by radiant energy induced deposition of a metal from metal alkyls oi metal carbonyls. These metallic compounds are subjected to thermal decomposition. Thus free metals and gaseous by-products are produced. For example, vaporous triisobutyl aluminum is passed over the surface of a substrate material which is placed in a vacuum system.

The partial vapor pressure of the triisobutyl aluminum is maintained at about 10 mm of Hg or less.

As the vapor passes over the substrate, selective portions of the substrate are heated by radiant energy. The compound decomposes at the heated sites and metallic aluminum deposits on the substrate to produce a desired conductive pattern.

Alternately, the substrate can be dip-coated with a desired metal alkyl hydride, e.g., diisobutyl aluminum hydride, and subsequently heated by exposing it to radiant energy under a pattern. The free metal is deposited as above in a desired conductive pattern.

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