Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Testing Semiconductor Devices Prior to Wafer Dicing

IP.com Disclosure Number: IPCOM000092715D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Napier, J: AUTHOR

Abstract

To test the ball metallurgy of semiconductor devices on a wafer prior to dicing, a tension testing method is employed. Test chips are affixed to balls at various locations and removed under tension. The wafer being tested is aligned under a highly reflective heat shield. The shield contains square holes located over the wafer sites to be tested. Balled or unballed test chips are placed in the square holes of the heat shield and soldered to the device contacts under controlled heat. After cooling, the usual ball adhesion testing is performed.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Testing Semiconductor Devices Prior to Wafer Dicing

To test the ball metallurgy of semiconductor devices on a wafer prior to dicing, a tension testing method is employed. Test chips are affixed to balls at various locations and removed under tension. The wafer being tested is aligned under a highly reflective heat shield. The shield contains square holes located over the wafer sites to be tested. Balled or unballed test chips are placed in the square holes of the heat shield and soldered to the device contacts under controlled heat. After cooling, the usual ball adhesion testing is performed.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]