Browse Prior Art Database

Modular Conduction Cooling System

IP.com Disclosure Number: IPCOM000092719D
Original Publication Date: 1967-Feb-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR

Abstract

This cooling arrangement removes heat by conduction from back plates 11 of electronic components. Hollow modules 13 are attached by screws 15 to back plates 11. Conduits 17, 18, and 19 pass coolant to the interior of the top module and then to the second displaced module without interruption of flow in conduit 19, This facilitates checking out the uncovered module while cooling continues. Cooling conduit 21 from the fourth module to the fifth module is broken away to show the screw attachment.

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Modular Conduction Cooling System

This cooling arrangement removes heat by conduction from back plates 11 of electronic components. Hollow modules 13 are attached by screws 15 to back plates 11. Conduits 17, 18, and 19 pass coolant to the interior of the top module and then to the second displaced module without interruption of flow in conduit 19, This facilitates checking out the uncovered module while cooling continues. Cooling conduit 21 from the fourth module to the fifth module is broken away to show the screw attachment.

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