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Stabilizing Low Temperature Nickel Iron Plating Bath

IP.com Disclosure Number: IPCOM000092823D
Original Publication Date: 1967-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Schmeckenbecher, AF: AUTHOR

Abstract

The composition of chemical nickel-iron films plated on copper by reduction with sodium hypophosphite depends to a large extent on the age of the bath. The use of ammonium chloride in the bath leads to more uniform iron content in films formed from baths up to 24 hours old.

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Stabilizing Low Temperature Nickel Iron Plating Bath

The composition of chemical nickel-iron films plated on copper by reduction with sodium hypophosphite depends to a large extent on the age of the bath. The use of ammonium chloride in the bath leads to more uniform iron content in films formed from baths up to 24 hours old.

For example, copper strips activated by a dip in a palladium solution are plated at 25 degrees C, about 1000 Angstroms thick, Ni Fe films, for 25 minutes each from a bath immediately after makeup and at various times of aging. The baths are kept in stoppered bottles. The pH value does not change appreciably during 24 hours. For analysis, the samples are dissolved and intensities of X-ray fluorescence peaks are compared with standard nickel and iron solutions. The precision of the analysis is about +/-3%.

The table shows that the bath containing ammonium chloride, bath 3, yields films of much more uniform composition during 24 hours, than a high pH bath, bath 1, and a low pH bath, bath 2.

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