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Preparing Insulating Layers for Ni Fe Plating

IP.com Disclosure Number: IPCOM000092904D
Original Publication Date: 1967-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Geldermans, P: AUTHOR [+2]

Abstract

Some magnetic film memory structures have the form of a magnetic film and conductors arranged on opposite sides of a planar insulator. These structures can be fabricated by coating the insulator with a thermally decomposible organic compound of a noble metal such as gold acetyl-acetonate, followed by a thermal decomposition. The resulting gold layer on the insulator is featureless. There are no crystals, dendrites or nodules. It has a high conductivity so that electroplating can be effected on it to form the desired magnetic film. Other advantages of this technique are that no vacuum process is needed, no chemical activation is needed, and, if desired, electroless plating can be effected on the gold layer.

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Preparing Insulating Layers for Ni Fe Plating

Some magnetic film memory structures have the form of a magnetic film and conductors arranged on opposite sides of a planar insulator. These structures can be fabricated by coating the insulator with a thermally decomposible organic compound of a noble metal such as gold acetyl-acetonate, followed by a thermal decomposition. The resulting gold layer on the insulator is featureless. There are no crystals, dendrites or nodules. It has a high conductivity so that electroplating can be effected on it to form the desired magnetic film. Other advantages of this technique are that no vacuum process is needed, no chemical activation is needed, and, if desired, electroless plating can be effected on the gold layer.

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