Browse Prior Art Database

Ferrite Core Memory Module

IP.com Disclosure Number: IPCOM000092918D
Original Publication Date: 1967-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Covaleski, JF: AUTHOR

Abstract

Interplane welding is avoided by stacking core planes in order of ever increasing size and joining the core planes electrically with plated through-holes. Memory planes 10 are stacked one on top of the other in the order of increasing aperture magnitudes. Thus the module resembles an amphitheater with its stepped levels. Core lines 12 are connected to pads 14 on each level. Pads 14 are interconnected by plated through-holes 16 so as to eliminate the necessity of joining the various planes together by welding. If it is desired, the module can be hermetically sealed in its own coolant.

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Ferrite Core Memory Module

Interplane welding is avoided by stacking core planes in order of ever increasing size and joining the core planes electrically with plated through-holes. Memory planes 10 are stacked one on top of the other in the order of increasing aperture magnitudes. Thus the module resembles an amphitheater with its stepped levels. Core lines 12 are connected to pads 14 on each level. Pads 14 are interconnected by plated through-holes 16 so as to eliminate the necessity of joining the various planes together by welding. If it is desired, the module can be hermetically sealed in its own coolant.

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