Browse Prior Art Database

Semiconductor Wafer Centering Device

IP.com Disclosure Number: IPCOM000092941D
Original Publication Date: 1967-Mar-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Gordon, JD: AUTHOR

Abstract

This device aligns and attaches a semiconductor wafer on a carrier of the type used to support the wafer during subsequent processing operations.

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Semiconductor Wafer Centering Device

This device aligns and attaches a semiconductor wafer on a carrier of the type used to support the wafer during subsequent processing operations.

Device 10 has a circular downwardly facing opening 12 adapted to receive the carrier 14. The latter can be provided with flange 15 which engages the annular flat bottom surface 16. Tapered circular chamber 18 terminates over the top surface of carrier 14 with slot 20 opening into such chamber. Spring-biased plunger 22 having a flat surface 24 is axially disposed above chamber 18.

In use, the assembled device 10 and carrier 14 are heated on a hot surface. An adhesive pellet is melted on the top surface of carrier 14. Wafer 26 is loaded through slot 20 which settles upon carrier 14 and is automatically centered by the tapered wall of chamber 18. The melted adhesive pellet is thus sandwiched between carrier 14 and wafer 26. Plunger 22 is then depressed and rotated to assure a uniform layer of adhesive. The resultant assembly is cooled and the carrier and adhered wafer are removed.

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